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  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0813-02-2AE81-A
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0813-02-2AE81-A
Model TE0813-02-2AE81-A
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Trenz Electronic
Description MPSOC MODULE WI
Encapsulation -
Package Bulk
RoHS Status 1
Price: $363.7500
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image of Microcontrollers, Microprocessor, FPGA Modules>22081843
22081843
Model
22081843
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Description
MPSOC MODULE WI
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
TYPEDESCRIPTION
MfrTrenz Electronic
SeriesZynq UltraScale+
PackageBulk
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 4 x 240
Size / Dimension2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size4GB
Operating Temperature0°C ~ 85°C
Module/Board TypeMPU Core
Core ProcessorXilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size128MB
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