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  • image of Microcontrollers, Microprocessor, FPGA Modules>AM0010-02-3BI21MA
  • image of Microcontrollers, Microprocessor, FPGA Modules>AM0010-02-3BI21MA
Model AM0010-02-3BI21MA
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Trenz Electronic
Description MPSOC MODULE WI
Encapsulation -
Package Bulk
RoHS Status 1
Price: $650.0000
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image of Microcontrollers, Microprocessor, FPGA Modules>20418083
20418083
Model
20418083
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Description
MPSOC MODULE WI
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
TYPEDESCRIPTION
MfrTrenz Electronic
SeriesZynq® UltraScale+™
PackageBulk
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket
Size / Dimension2.205" L x 1.575" W (56.00mm x 40.00mm)
RAM Size4GB
Operating Temperature-40°C ~ 85°C
Module/Board TypeMPU Core
Core ProcessorZynq™ UltraScale+™ ZU3EG-1I
Flash Size128MB
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