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  • image of Microcontrollers>HX6537-A09TDIG
  • image of Microcontrollers>HX6537-A09TDIG
Model HX6537-A09TDIG
Product Category Microcontrollers
Manufacturer Himax Technologies
Description IC MCU 2MB FLAS
Encapsulation -
Package Tray
RoHS Status 1
Price: $14.5000
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image of Microcontrollers>14109827
14109827
Model
14109827
Product Category
Microcontrollers
Manufacturer
Himax Technologies
Description
IC MCU 2MB FLAS
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrHimax Technologies
Series-
PackageTray
Product StatusACTIVE
Package / Case72-VFQFN Exposed Pad
Mounting TypeSurface Mount
Speed400MHz
Program Memory Size320KB (320K x 8)
RAM Size2M x 8
Oscillator TypeInternal
Program Memory TypeSRAM
Core ProcessorARC EM9D
Data ConvertersA/D 4x12b
Core Size32-Bit
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V
ConnectivityI2C, PDM, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, Sensor I/F, WDT
Supplier Device Package72-QFN (8x8)
Number of I/O9
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